Summary
Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.
According to APO Research, The global Through-Silicon Vias (TSVs) market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The US & Canada market for Through-Silicon Vias (TSVs) is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
Asia-Pacific market for Through-Silicon Vias (TSVs) is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The China market for Through-Silicon Vias (TSVs) is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
Europe market for Through-Silicon Vias (TSVs) is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.
The major global companies of Through-Silicon Vias (TSVs) include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung and Tianshui Huatian Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Includes
This report presents an overview of global market for Through-Silicon Vias (TSVs), market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Through-Silicon Vias (TSVs), also provides the revenue of main regions and countries. Of the upcoming market potential for Through-Silicon Vias (TSVs), and key regions or countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Through-Silicon Vias (TSVs) revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Through-Silicon Vias (TSVs) market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Through-Silicon Vias (TSVs) revenue, projected growth trends, production technology, application and end-user industry.
Through-Silicon Vias (TSVs) segment by Company
ASE Technology Holding
Amkor Technology
Taiwan Semiconductor Manufacturing Company Limited
Intel Corporation
GLOBALFOUNDRIES
JCET Group
Samsung
Tianshui Huatian Technology
Through-Silicon Vias (TSVs) segment by Type
2.5D Through-Silicon Vias
3D Through-Silicon Vias
Through-Silicon Vias (TSVs) segment by Application
Mobile And Consumer Electronics
Communication Equipment
Automotive And Transportation Electronics
Through-Silicon Vias (TSVs) segment by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Study Objectives
1. To analyze and research the global status and future forecast, involving growth rate (CAGR), market share, historical and forecast.
2. To present the key players, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Through-Silicon Vias (TSVs) market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Through-Silicon Vias (TSVs) and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in market size), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Through-Silicon Vias (TSVs).
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Revenue of Through-Silicon Vias (TSVs) in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of Through-Silicon Vias (TSVs) company competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Through-Silicon Vias (TSVs) revenue, gross margin, and recent development, etc.
Chapter 8: North America (US & Canada) by type, by application and by country, revenue for each segment.
Chapter 9: Europe by type, by application and by country, revenue for each segment.
Chapter 10: China type, by application, revenue for each segment.
Chapter 11: Asia (excluding China) type, by application and by region, revenue for each segment.
Chapter 12: Middle East, Africa, and Latin America type, by application and by country, revenue for each segment.
Chapter 13: The main concluding insights of the report.
1 Market Overview
1.1 Product Definition
1.2 Through-Silicon Vias (TSVs) Market by Type
1.2.1 Global Through-Silicon Vias (TSVs) Market Size by Type, 2019 VS 2023 VS 2030
1.2.2 2.5D Through-Silicon Vias
1.2.3 3D Through-Silicon Vias
1.3 Through-Silicon Vias (TSVs) Market by Application
1.3.1 Global Through-Silicon Vias (TSVs) Market Size by Application, 2019 VS 2023 VS 2030
1.3.2 Mobile And Consumer Electronics
1.3.3 Communication Equipment
1.3.4 Automotive And Transportation Electronics
1.4 Assumptions and Limitations
1.5 Study Goals and Objectives
2 Through-Silicon Vias (TSVs) Market Dynamics
2.1 Through-Silicon Vias (TSVs) Industry Trends
2.2 Through-Silicon Vias (TSVs) Industry Drivers
2.3 Through-Silicon Vias (TSVs) Industry Opportunities and Challenges
2.4 Through-Silicon Vias (TSVs) Industry Restraints
3 Global Growth Perspective
3.1 Global Through-Silicon Vias (TSVs) Market Perspective (2019-2030)
3.2 Global Through-Silicon Vias (TSVs) Growth Trends by Region
3.2.1 Global Through-Silicon Vias (TSVs) Market Size by Region: 2019 VS 2023 VS 2030
3.2.2 Global Through-Silicon Vias (TSVs) Market Size by Region (2019-2024)
3.2.3 Global Through-Silicon Vias (TSVs) Market Size by Region (2025-2030)
4 Competitive Landscape by Players
4.1 Global Through-Silicon Vias (TSVs) Revenue by Players
4.1.1 Global Through-Silicon Vias (TSVs) Revenue by Players (2019-2024)
4.1.2 Global Through-Silicon Vias (TSVs) Revenue Market Share by Players (2019-2024)
4.1.3 Global Through-Silicon Vias (TSVs) Players Revenue Share Top 10 and Top 5 in 2023
4.2 Global Through-Silicon Vias (TSVs) Key Players Ranking, 2022 VS 2023 VS 2024
4.3 Global Through-Silicon Vias (TSVs) Key Players Headquarters & Area Served
4.4 Global Through-Silicon Vias (TSVs) Players, Product Type & Application
4.5 Global Through-Silicon Vias (TSVs) Players Commercialization Time
4.6 Market Competitive Analysis
4.6.1 Global Through-Silicon Vias (TSVs) Market CR5 and HHI
4.6.2 Global Top 5 and 10 Through-Silicon Vias (TSVs) Players Market Share by Revenue in 2023
4.6.3 2023 Through-Silicon Vias (TSVs) Tier 1, Tier 2, and Tier 3
5 Through-Silicon Vias (TSVs) Market Size by Type
5.1 Global Through-Silicon Vias (TSVs) Revenue by Type (2019 VS 2023 VS 2030)
5.2 Global Through-Silicon Vias (TSVs) Revenue by Type (2019-2030)
5.3 Global Through-Silicon Vias (TSVs) Revenue Market Share by Type (2019-2030)
6 Through-Silicon Vias (TSVs) Market Size by Application
6.1 Global Through-Silicon Vias (TSVs) Revenue by Application (2019 VS 2023 VS 2030)
6.2 Global Through-Silicon Vias (TSVs) Revenue by Application (2019-2030)
6.3 Global Through-Silicon Vias (TSVs) Revenue Market Share by Application (2019-2030)
7 Company Profiles
7.1 ASE Technology Holding
7.1.1 ASE Technology Holding Comapny Information
7.1.2 ASE Technology Holding Business Overview
7.1.3 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue and Gross Margin (2019-2024)
7.1.4 ASE Technology Holding Through-Silicon Vias (TSVs) Product Portfolio
7.1.5 ASE Technology Holding Recent Developments
7.2 Amkor Technology
7.2.1 Amkor Technology Comapny Information
7.2.2 Amkor Technology Business Overview
7.2.3 Amkor Technology Through-Silicon Vias (TSVs) Revenue and Gross Margin (2019-2024)
7.2.4 Amkor Technology Through-Silicon Vias (TSVs) Product Portfolio
7.2.5 Amkor Technology Recent Developments
7.3 Taiwan Semiconductor Manufacturing Company Limited
7.3.1 Taiwan Semiconductor Manufacturing Company Limited Comapny Information
7.3.2 Taiwan Semiconductor Manufacturing Company Limited Business Overview
7.3.3 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue and Gross Margin (2019-2024)
7.3.4 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Product Portfolio
7.3.5 Taiwan Semiconductor Manufacturing Company Limited Recent Developments
7.4 Intel Corporation
7.4.1 Intel Corporation Comapny Information
7.4.2 Intel Corporation Business Overview
7.4.3 Intel Corporation Through-Silicon Vias (TSVs) Revenue and Gross Margin (2019-2024)
7.4.4 Intel Corporation Through-Silicon Vias (TSVs) Product Portfolio
7.4.5 Intel Corporation Recent Developments
7.5 GLOBALFOUNDRIES
7.5.1 GLOBALFOUNDRIES Comapny Information
7.5.2 GLOBALFOUNDRIES Business Overview
7.5.3 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue and Gross Margin (2019-2024)
7.5.4 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Product Portfolio
7.5.5 GLOBALFOUNDRIES Recent Developments
7.6 JCET Group
7.6.1 JCET Group Comapny Information
7.6.2 JCET Group Business Overview
7.6.3 JCET Group Through-Silicon Vias (TSVs) Revenue and Gross Margin (2019-2024)
7.6.4 JCET Group Through-Silicon Vias (TSVs) Product Portfolio
7.6.5 JCET Group Recent Developments
7.7 Samsung
7.7.1 Samsung Comapny Information
7.7.2 Samsung Business Overview
7.7.3 Samsung Through-Silicon Vias (TSVs) Revenue and Gross Margin (2019-2024)
7.7.4 Samsung Through-Silicon Vias (TSVs) Product Portfolio
7.7.5 Samsung Recent Developments
7.8 Tianshui Huatian Technology
7.8.1 Tianshui Huatian Technology Comapny Information
7.8.2 Tianshui Huatian Technology Business Overview
7.8.3 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue and Gross Margin (2019-2024)
7.8.4 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Product Portfolio
7.8.5 Tianshui Huatian Technology Recent Developments
8 North America
8.1 North America Through-Silicon Vias (TSVs) Revenue (2019-2030)
8.2 North America Through-Silicon Vias (TSVs) Revenue by Type (2019-2030)
8.2.1 North America Through-Silicon Vias (TSVs) Revenue by Type (2019-2024)
8.2.2 North America Through-Silicon Vias (TSVs) Revenue by Type (2025-2030)
8.3 North America Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
8.4 North America Through-Silicon Vias (TSVs) Revenue by Application (2019-2030)
8.4.1 North America Through-Silicon Vias (TSVs) Revenue by Application (2019-2024)
8.4.2 North America Through-Silicon Vias (TSVs) Revenue by Application (2025-2030)
8.5 North America Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
8.6 North America Through-Silicon Vias (TSVs) Revenue by Country
8.6.1 North America Through-Silicon Vias (TSVs) Revenue by Country (2019 VS 2023 VS 2030)
8.6.2 North America Through-Silicon Vias (TSVs) Revenue by Country (2019-2024)
8.6.3 North America Through-Silicon Vias (TSVs) Revenue by Country (2025-2030)
8.6.4 United States
8.6.5 Canada
9 Europe
9.1 Europe Through-Silicon Vias (TSVs) Revenue (2019-2030)
9.2 Europe Through-Silicon Vias (TSVs) Revenue by Type (2019-2030)
9.2.1 Europe Through-Silicon Vias (TSVs) Revenue by Type (2019-2024)
9.2.2 Europe Through-Silicon Vias (TSVs) Revenue by Type (2025-2030)
9.3 Europe Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
9.4 Europe Through-Silicon Vias (TSVs) Revenue by Application (2019-2030)
9.4.1 Europe Through-Silicon Vias (TSVs) Revenue by Application (2019-2024)
9.4.2 Europe Through-Silicon Vias (TSVs) Revenue by Application (2025-2030)
9.5 Europe Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
9.6 Europe Through-Silicon Vias (TSVs) Revenue by Country
9.6.1 Europe Through-Silicon Vias (TSVs) Revenue by Country (2019 VS 2023 VS 2030)
9.6.2 Europe Through-Silicon Vias (TSVs) Revenue by Country (2019-2024)
9.6.3 Europe Through-Silicon Vias (TSVs) Revenue by Country (2025-2030)
9.6.4 Germany
9.6.5 France
9.6.6 U.K.
9.6.7 Italy
9.6.8 Russia
10 China
10.1 China Through-Silicon Vias (TSVs) Revenue (2019-2030)
10.2 China Through-Silicon Vias (TSVs) Revenue by Type (2019-2030)
10.2.1 China Through-Silicon Vias (TSVs) Revenue by Type (2019-2024)
10.2.2 China Through-Silicon Vias (TSVs) Revenue by Type (2025-2030)
10.3 China Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
10.4 China Through-Silicon Vias (TSVs) Revenue by Application (2019-2030)
10.4.1 China Through-Silicon Vias (TSVs) Revenue by Application (2019-2024)
10.4.2 China Through-Silicon Vias (TSVs) Revenue by Application (2025-2030)
10.5 China Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
11 Asia (Excluding China)
11.1 Asia Through-Silicon Vias (TSVs) Revenue (2019-2030)
11.2 Asia Through-Silicon Vias (TSVs) Revenue by Type (2019-2030)
11.2.1 Asia Through-Silicon Vias (TSVs) Revenue by Type (2019-2024)
11.2.2 Asia Through-Silicon Vias (TSVs) Revenue by Type (2025-2030)
11.3 Asia Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
11.4 Asia Through-Silicon Vias (TSVs) Revenue by Application (2019-2030)
11.4.1 Asia Through-Silicon Vias (TSVs) Revenue by Application (2019-2024)
11.4.2 Asia Through-Silicon Vias (TSVs) Revenue by Application (2025-2030)
11.5 Asia Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
11.6 Asia Through-Silicon Vias (TSVs) Revenue by Country
11.6.1 Asia Through-Silicon Vias (TSVs) Revenue by Country (2019 VS 2023 VS 2030)
11.6.2 Asia Through-Silicon Vias (TSVs) Revenue by Country (2019-2024)
11.6.3 Asia Through-Silicon Vias (TSVs) Revenue by Country (2025-2030)
11.6.4 Japan
11.6.5 South Korea
11.6.6 India
11.6.7 Australia
11.6.8 China Taiwan
11.6.9 Southeast Asia
12 Middle East, Africa, Latin America
12.1 MEALA Through-Silicon Vias (TSVs) Revenue (2019-2030)
12.2 MEALA Through-Silicon Vias (TSVs) Revenue by Type (2019-2030)
12.2.1 MEALA Through-Silicon Vias (TSVs) Revenue by Type (2019-2024)
12.2.2 MEALA Through-Silicon Vias (TSVs) Revenue by Type (2025-2030)
12.3 MEALA Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
12.4 MEALA Through-Silicon Vias (TSVs) Revenue by Application (2019-2030)
12.4.1 MEALA Through-Silicon Vias (TSVs) Revenue by Application (2019-2024)
12.4.2 MEALA Through-Silicon Vias (TSVs) Revenue by Application (2025-2030)
12.5 MEALA Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
12.6 MEALA Through-Silicon Vias (TSVs) Revenue by Country
12.6.1 MEALA Through-Silicon Vias (TSVs) Revenue by Country (2019 VS 2023 VS 2030)
12.6.2 MEALA Through-Silicon Vias (TSVs) Revenue by Country (2019-2024)
12.6.3 MEALA Through-Silicon Vias (TSVs) Revenue by Country (2025-2030)
12.6.4 Mexico
12.6.5 Brazil
12.6.6 Israel
12.6.7 Argentina
12.6.8 Colombia
12.6.9 Turkey
12.6.10 Saudi Arabia
12.6.11 UAE
13 Concluding Insights
14 Appendix
14.1 Reasons for Doing This Study
14.2 Research Methodology
14.3 Research Process
14.4 Authors List of This Report
14.5 Data Source
14.5.1 Secondary Sources
14.5.2 Primary Sources
14.6 Disclaimer
List of Tables
Table 1. Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Type (US$ Million), 2019 VS 2023 VS 2030
Table 1. 2.5D Through-Silicon Vias Major Manufacturers
Table 2. 3D Through-Silicon Vias Major Manufacturers
Table 3. Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Application (US$ Million), 2019 VS 2023 VS 2030
Table 4. Mobile And Consumer Electronics Major Manufacturers
Table 5. Communication Equipment Major Manufacturers
Table 6. Automotive And Transportation Electronics Major Manufacturers
Table 7. Through-Silicon Vias (TSVs) Industry Trends
Table 8. Through-Silicon Vias (TSVs) Industry Drivers
Table 9. Through-Silicon Vias (TSVs) Industry Opportunities and Challenges
Table 10. Through-Silicon Vias (TSVs) Industry Restraints
Table 11. Global Through-Silicon Vias (TSVs) Market Size Growth Rate (CAGR) by Region (US$ Million): 2019 VS 2023 VS 2030
Table 12. Global Through-Silicon Vias (TSVs) Market Size by Region (2019-2024) & (US$ Million)
Table 13. Global Through-Silicon Vias (TSVs) Market Share by Region (2019-2024)
Table 14. Global Through-Silicon Vias (TSVs) Market Size by Region (2025-2030) & (US$ Million)
Table 15. Global Through-Silicon Vias (TSVs) Market Share by Region (2025-2030)
Table 16. Global Through-Silicon Vias (TSVs) Revenue by Players (US$ Million) & (2019-2024)
Table 17. Global Through-Silicon Vias (TSVs) Revenue Market Share by Players (2019-2024)
Table 18. Global Through-Silicon Vias (TSVs) Key Players Ranking, 2022 VS 2023 VS 2024
Table 19. Global Through-Silicon Vias (TSVs) Key Players Headquarters & Area Served
Table 20. Global Through-Silicon Vias (TSVs) Players, Product Type & Application
Table 21. Global Through-Silicon Vias (TSVs) Players Commercialization Time
Table 22. Global Players Market Concentration Ratio (CR5 and HHI)
Table 23. Global Through-Silicon Vias (TSVs) by Players Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue of 2023)
Table 24. Global Through-Silicon Vias (TSVs) Revenue by Type 2019 VS 2023 VS 2030 (US$ Million)
Table 25. Global Through-Silicon Vias (TSVs) Revenue by Type (2019-2024) & (US$ Million)
Table 26. Global Through-Silicon Vias (TSVs) Revenue by Type (2025-2030) & (US$ Million)
Table 27. Global Through-Silicon Vias (TSVs) Revenue Market Share by Type (2019-2024) & (US$ Million)
Table 28. Global Through-Silicon Vias (TSVs) Revenue Market Share by Type (2025-2030) & (US$ Million)
Table 29. Global Through-Silicon Vias (TSVs) Revenue by Application 2019 VS 2023 VS 2030 (US$ Million)
Table 30. Global Through-Silicon Vias (TSVs) Revenue by Application (2019-2024) & (US$ Million)
Table 31. Global Through-Silicon Vias (TSVs) Revenue by Application (2025-2030) & (US$ Million)
Table 32. Global Through-Silicon Vias (TSVs) Revenue Market Share by Application (2019-2024) & (US$ Million)
Table 33. Global Through-Silicon Vias (TSVs) Revenue Market Share by Application (2025-2030) & (US$ Million)
Table 34. ASE Technology Holding Company Information
Table 35. ASE Technology Holding Business Overview
Table 36. ASE Technology Holding Through-Silicon Vias (TSVs) Revenue and Gross Margin (US$ Million) & (2019-2024)
Table 37. ASE Technology Holding Through-Silicon Vias (TSVs) Product Portfolio
Table 38. ASE Technology Holding Recent Development
Table 39. Amkor Technology Company Information
Table 40. Amkor Technology Business Overview
Table 41. Amkor Technology Through-Silicon Vias (TSVs) Revenue and Gross Margin (US$ Million) & (2019-2024)
Table 42. Amkor Technology Through-Silicon Vias (TSVs) Product Portfolio
Table 43. Amkor Technology Recent Development
Table 44. Taiwan Semiconductor Manufacturing Company Limited Company Information
Table 45. Taiwan Semiconductor Manufacturing Company Limited Business Overview
Table 46. Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue and Gross Margin (US$ Million) & (2019-2024)
Table 47. Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Product Portfolio
Table 48. Taiwan Semiconductor Manufacturing Company Limited Recent Development
Table 49. Intel Corporation Company Information
Table 50. Intel Corporation Business Overview
Table 51. Intel Corporation Through-Silicon Vias (TSVs) Revenue and Gross Margin (US$ Million) & (2019-2024)
Table 52. Intel Corporation Through-Silicon Vias (TSVs) Product Portfolio
Table 53. Intel Corporation Recent Development
Table 54. GLOBALFOUNDRIES Company Information
Table 55. GLOBALFOUNDRIES Business Overview
Table 56. GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue and Gross Margin (US$ Million) & (2019-2024)
Table 57. GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Product Portfolio
Table 58. GLOBALFOUNDRIES Recent Development
Table 59. JCET Group Company Information
Table 60. JCET Group Business Overview
Table 61. JCET Group Through-Silicon Vias (TSVs) Revenue and Gross Margin (US$ Million) & (2019-2024)
Table 62. JCET Group Through-Silicon Vias (TSVs) Product Portfolio
Table 63. JCET Group Recent Development
Table 64. Samsung Company Information
Table 65. Samsung Business Overview
Table 66. Samsung Through-Silicon Vias (TSVs) Revenue and Gross Margin (US$ Million) & (2019-2024)
Table 67. Samsung Through-Silicon Vias (TSVs) Product Portfolio
Table 68. Samsung Recent Development
Table 69. Tianshui Huatian Technology Company Information
Table 70. Tianshui Huatian Technology Business Overview
Table 71. Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue and Gross Margin (US$ Million) & (2019-2024)
Table 72. Tianshui Huatian Technology Through-Silicon Vias (TSVs) Product Portfolio
Table 73. Tianshui Huatian Technology Recent Development
Table 74. North America Through-Silicon Vias (TSVs) Revenue by Type (2019-2024) & (US$ Million)
Table 75. North America Through-Silicon Vias (TSVs) Revenue by Application (2019-2024) & (US$ Million)
Table 76. North America Through-Silicon Vias (TSVs) Revenue by Country (2019 VS 2023 VS 2030) & (US$ Million)
Table 77. North America Through-Silicon Vias (TSVs) Revenue by Country (2019-2024) & (US$ Million)
Table 78. North America Through-Silicon Vias (TSVs) Revenue by Country (2025-2030) & (US$ Million)
Table 79. Europe Through-Silicon Vias (TSVs) Revenue by Type (2019-2024) & (US$ Million)
Table 80. Europe Through-Silicon Vias (TSVs) Revenue by Application (2019-2024) & (US$ Million)
Table 81. Europe Through-Silicon Vias (TSVs) Revenue by Country (2019 VS 2023 VS 2030) & (US$ Million)
Table 82. Europe Through-Silicon Vias (TSVs) Revenue by Country (2019-2024) & (US$ Million)
Table 83. Europe Through-Silicon Vias (TSVs) Revenue by Country (2025-2030) & (US$ Million)
Table 84. China Through-Silicon Vias (TSVs) Revenue by Type (2019-2024) & (US$ Million)
Table 85. China Through-Silicon Vias (TSVs) Revenue by Application (2019-2024) & (US$ Million)
Table 86. Asia Through-Silicon Vias (TSVs) Revenue by Type (2019-2024) & (US$ Million)
Table 87. Asia Through-Silicon Vias (TSVs) Revenue by Application (2019-2024) & (US$ Million)
Table 88. Asia Through-Silicon Vias (TSVs) Revenue by Country (2019 VS 2023 VS 2030) & (US$ Million)
Table 89. Asia Through-Silicon Vias (TSVs) Revenue by Country (2019-2024) & (US$ Million)
Table 90. Asia Through-Silicon Vias (TSVs) Revenue by Country (2025-2030) & (US$ Million)
Table 91. MEALA Through-Silicon Vias (TSVs) Revenue by Type (2019-2024) & (US$ Million)
Table 92. MEALA Through-Silicon Vias (TSVs) Revenue by Application (2019-2024) & (US$ Million)
Table 93. MEALA Through-Silicon Vias (TSVs) Revenue by Country (2019 VS 2023 VS 2030) & (US$ Million)
Table 94. MEALA Through-Silicon Vias (TSVs) Revenue by Country (2019-2024) & (US$ Million)
Table 95. MEALA Through-Silicon Vias (TSVs) Revenue by Country (2025-2030) & (US$ Million)
Table 96. Research Programs/Design for This Report
Table 97. Authors List of This Report
Table 98. Secondary Sources
Table 99. Primary Sources
List of Figures
Figure 1. Through-Silicon Vias (TSVs) Product Picture
Figure 2. Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Type (US$ Million), 2019 VS 2023 VS 2030
Figure 3. Global Through-Silicon Vias (TSVs) Market Size Share 2019 VS 2023 VS 2030
Figure 4. 2.5D Through-Silicon Vias Picture
Figure 5. 3D Through-Silicon Vias Picture
Figure 6. Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Application (US$ Million), 2019 VS 2023 VS 2030
Figure 7. Global Through-Silicon Vias (TSVs) Market Size Share 2019 VS 2023 VS 2030
Figure 8. Mobile And Consumer Electronics Picture
Figure 9. Communication Equipment Picture
Figure 10. Automotive And Transportation Electronics Picture
Figure 11. Global Through-Silicon Vias (TSVs) Market Size (US$ Million) & (2019-2030)
Figure 12. Global Through-Silicon Vias (TSVs) Market Size, (US$ Million), 2019 VS 2023 VS 2030
Figure 13. Global Through-Silicon Vias (TSVs) Market Share by Region: 2019 VS 2023 VS 2030
Figure 14. Global Through-Silicon Vias (TSVs) Players Revenue Share Top 10 and Top 5 in 2023
Figure 15. Players Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 16. Global Through-Silicon Vias (TSVs) Revenue by Type (2019 VS 2023 VS 2030) & (US$ Million)
Figure 17. Global Through-Silicon Vias (TSVs) Revenue Market Share 2019 VS 2023 VS 2030
Figure 18. Global Through-Silicon Vias (TSVs) Revenue Market Share by Type (2019-2030)
Figure 19. Global Through-Silicon Vias (TSVs) Revenue by Application (2019 VS 2023 VS 2030) & (US$ Million)
Figure 20. Global Through-Silicon Vias (TSVs) Revenue Market Share by Application (2019 VS 2023 VS 2030)
Figure 21. Global Through-Silicon Vias (TSVs) Revenue Market Share by Application (2019-2030)
Figure 22. North America Through-Silicon Vias (TSVs) Revenue YoY Growth (2019-2030) & (US$ Million)
Figure 23. North America Through-Silicon Vias (TSVs) Revenue by Type (2025-2030) & (US$ Million)
Figure 24. North America Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
Figure 25. North America Through-Silicon Vias (TSVs) Revenue by Application (2025-2030) & (US$ Million)
Figure 26. North America Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
Figure 27. North America Through-Silicon Vias (TSVs) Revenue Share by Country (2019-2030)
Figure 28. United States Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 29. Canada Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 30. Europe Through-Silicon Vias (TSVs) Revenue YoY Growth (2019-2030) & (US$ Million)
Figure 31. Europe Through-Silicon Vias (TSVs) Revenue by Type (2025-2030) & (US$ Million)
Figure 32. Europe Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
Figure 33. Europe Through-Silicon Vias (TSVs) Revenue by Application (2025-2030) & (US$ Million)
Figure 34. Europe Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
Figure 35. Europe Through-Silicon Vias (TSVs) Revenue Share by Country (2019-2030)
Figure 36. Germany Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 37. France Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 38. U.K. Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 39. Italy Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 40. Russia Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 41. Nordic Countries Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 42. China Through-Silicon Vias (TSVs) Revenue YoY Growth (2019-2030) & (US$ Million)
Figure 43. China Through-Silicon Vias (TSVs) Revenue by Type (2025-2030) & (US$ Million)
Figure 44. China Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
Figure 45. China Through-Silicon Vias (TSVs) Revenue by Application (2025-2030) & (US$ Million)
Figure 46. China Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
Figure 47. Asia Through-Silicon Vias (TSVs) Revenue YoY Growth (2019-2030) & (US$ Million)
Figure 48. Asia Through-Silicon Vias (TSVs) Revenue by Type (2025-2030) & (US$ Million)
Figure 49. Asia Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
Figure 50. Asia Through-Silicon Vias (TSVs) Revenue by Application (2025-2030) & (US$ Million)
Figure 51. Asia Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
Figure 52. Asia Through-Silicon Vias (TSVs) Revenue Share by Country (2019-2030)
Figure 53. Japan Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 54. South Korea Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 55. India Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 56. Australia Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 57. China Taiwan Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 58. Southeast Asia Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 59. MEALA Through-Silicon Vias (TSVs) Revenue YoY Growth (2019-2030) & (US$ Million)
Figure 60. MEALA Through-Silicon Vias (TSVs) Revenue by Type (2025-2030) & (US$ Million)
Figure 61. MEALA Through-Silicon Vias (TSVs) Revenue Share by Type (2019-2030)
Figure 62. MEALA Through-Silicon Vias (TSVs) Revenue by Application (2025-2030) & (US$ Million)
Figure 63. MEALA Through-Silicon Vias (TSVs) Revenue Share by Application (2019-2030)
Figure 64. MEALA Through-Silicon Vias (TSVs) Revenue Share by Country (2019-2030)
Figure 65. Mexico Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 66. South Korea Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 67. Brazil Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 68. Israel Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 69. Argentina Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 70. Colombia Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 71. Turkey Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 72. Saudi Arabia Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 73. UAE Through-Silicon Vias (TSVs) Revenue YoY Growth (US$ Million) & (2019-2030)
Figure 74. Years Considered
Figure 75. Research Process
Figure 76. Key Executives Interviewed
